Microwave Circuit Substrates

As a full service printed circuit board supplier, Entech Electronics is also able to offer non-standard PCB substrates such as those employed in high frequency communications and microwave applications.

Entech Electronics, through its links with the defence and communications industry, has developed advanced manufacturing techniques in microwave and satellite communications systems.

These products include precision milled microwave substrates requiring the bonding of teflon insulating materials, combined with various surface finishes including gold plating.

• Microstrip type circuits using PTFE based laminate and milled aluminium backing plates for high power RF and microwave circuit applications
• Accurate bonding of PTFE based laminates for stripline, dual stripline and aperture coupling applications
• Chemical processing and through hole plating of PTFE based laminates for low dielectric constant and low dissipation factor applications
• Aluminium bonding, chromate coating and electroplating for heat sink, microwave and slot-line applications
• High precision etching for critical microwave antenna and controlled impedance systems
• Precious metal plating processes suitable for operating frequencies to Ku band
• Multilayer PCBs for high frequency and controlled impedance applications
• Process testing by Time Domain reflectometry and microsection
• Various circuit finishes and product configurations availablele